Power electronic devices, heat dissipation technology, high power density
Abstract
With the continuous advancement of high-power power electronic devices, the thermal management technology of these devices plays a pivotal role in their practical application. In order to address the heat dissipation challenges associated with power electronic technology, this study focuses on four key aspects: the impact of temperature on power electronic devices, commonly employed heat dissipation techniques, relevant equipment for power electronic thermal management, and the utilization of novel materials for enhancing heat dissipation capabilities in power electronic devices. The application of conventional heat dissipation technology has been found to enhance the thermal management performance of high-power density power electronic devices.The continuous advancement in semiconductor materials has led to the emergence of numerous materials with excellent thermal conductivity.In order to enhance the heat dissipation efficiency of power electronic devices, it is imperative for researchers to further investigate the development and application of novel material technologies. The application of advanced semiconductor materials will be expanded in power electronic devices to enhance thermal management capabilities.
